strings.skip_to_content
Workshop

Advanced UCIe-based Chiplets verification from IP to SoC

Thursday, March 7, 2024

Moshik Rubin, Sr Product Management Group Director, Cadence; Anunay Bajaj, Sr Principal Product Engineer, Cadence

The emergence of the Universal Chiplet Interconnect Express (UCIe) standard has revolutionized the
electronics industry by enabling the integration of chiplets with diverse functionalities and technology
nodes into complex electronic chips. This advancement has introduced new challenges in RTL (Register-
Transfer Level) design, particularly in managing protocols like PCIe, CXL, and Streaming, as well as
implementing a novel Physical Layer and intricate Die-to-Die adapters. Consequently, the verification
complexities of such designs have grown exponentially.

This workshop delves into effective strategies for optimizing verification efforts and enhancing
productivity when working with UCIe-based designs, spanning from individual blocks to system-level
verification. Attendees will gain practical experience in:

  1. Seamlessly integrating various UCIe blocks with a Device Under Test (DUT).

  2. Streamlining the transition from Intellectual Property (IP) to System-on-Chip (SoC) level.

  3. Measuring and analyzing UCIE based system performance.

  4. Debugging UCIe related scenarios using advanced tools and methods.

Join us in this workshop to uncover solutions for tackling the challenges posed by UCIe-based designs,
identifying critical bottlenecks, and visualizing the performance impact, ultimately empowering
engineers to create more sophisticated electronic chips efficiently.

  • Cadence logo.

    Cadence

    DVCon Sponsors Accellera Global Sponsor

    Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics.