• Artificial Intelligence (AI) has transfixed the attention of the world and is infusing the electronics landscape from cloud-to-edge, including HPC, data center, PCs, smartphones, automotive, robots and many more devices. Architects and design teams are creatively producing AI engines that meet specific AI model and end-market application requirements. This new era of workload-specific AI accelerators necessitates new design, optimization, and verification strategies that must be performed in the context of the power and performance requirements of the end-market application.  This new generation of customized chips driven by software workloads requires innovative, advanced and AI-assisted methodologies to ensure successful tapeouts in an increasingly complex, cost-driven, and fast time to value (TTV) environment. Hear from Synopsys and Microsoft how industry leaders are addressing these challenges from silicon to system and paving the way for further advancements in this new AI-driven era of pervasive intelligence.

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      Ravi Subramanian

      Systems Design Group at Synopsys

      General Manager

    • Artour_Levin_squarecrop.png
      Artour Levin

      AI Silicon Engineering at Microsoft Corporation

      Vice President

  • CHIPS for America is a bipartisan program with the mission of strengthening America’s economic and national security by revitalizing America’s domestic semiconductor manufacturing and research and development ecosystem.  U.S. leadership in chip design has made US companies dominant players in technologies ranging from smartphones to cloud computing to artificial intelligence. Underlying that success has been a strong and diverse electronic design automation (EDA) sector. This talk looks at the history of EDA and how it has enabled the semiconductor revolution, where it currently faces challenges, and how CHIPS for America and its CHIPS National Advanced Packaging Manufacturing Program is helping to address those challenges going forward.