Oral/Lecture Sessions-Day 1:

Technical Session 1 [Functional Coverage Closure]

Tuesday, March 5, 2024

  • Seokho Lee, FuriosaAI; Youngsik Kim, FuriosaAI; Suhyung Kim, FuriosaAI; Jeong Ki Lee, FuriosaAI; Wooyoung Choe, FuriosaAI; Minho Kim, FuriosaAI

  • Robert Kunzelmann, Infineon Technologies AG, Technical University of Munich; Aishwarya Sridhar, Infineon Technologies AG; Daniel Gerl, Infineon Technologies AG, Technical University of Munich; Lakshmi Vidhath Boga, Infineon Technologies AG; Wolfgang Ecker, Infineon Technologies AG, Technical University of Munich

  • Jikjoo Lee, Samsung Electronics, Memory Division South Korea; Kihyun Park, Samsung Electronics, Memory Division South Korea; Tony Gladvin George, Samsung Electronics, Memory Division South Korea; Dongkun An, Samsung Electronics, Memory Division South Korea; Wooseong Cheong, Samsung Electronics, Memory Division South Korea; Byungchul Yoo, Samsung Electronics, Memory Division South Korea

  • Yash Phogat, Arm Inc.; Patrick Hamilton, Arm Inc.

Technical Session 2 [AI & ML in Verification]

Tuesday, March 5, 2024

  • Siarhei Zalivaka, Solidigm

  • Aman Kumar, Infineon Technologies; Deepak Narayan Gadde, Infineon Technologies; Thomas Nalapat, Infineon Technologies; Evgenii Rezunov, Infineon Technologies; Fabio Cappellini, Infineon Technologies

  • Olivera Stojanovic, Vtool; Nemanja Mitrovic, Vtool; Anna Revitzki, Vtool

  • Dan Yu, Siemens EDA; Harry Foster, Siemens EDA; Eman El Mandouh, Siemens EDA; Waseem Raslan, Siemens EDA; Tom Fitzpatrick, Siemens EDA

Technical Session 3 [Formal Verification Use Cases]

Tuesday, March 5, 2024

  • Bryan Olmos, Infineon Technologies AG; Sanjana Sainath, Infineon Technologies AG; Wolfgang Kunz, Rheinland-Pfälzische Technische Universität Kaiserslautern-Landau; Djones Lettnin, Infineon Technologies AG

  • Shuhang Zhang, Infineon Technologies AG; Bryan Olmos, Infineon Technologies AG; Basavaraj Naik, Infineon Technologies AG

  • Abhishek Asi, Intel; Anshul Jain, Intel; Virginia Bao, Intel

  • Mike Walsh, Siemens EDA; Jin Hou, Siemens EDA

Technical Session 4 [UVM Testbenches]

Tuesday, March 5, 2024

  • Aswini Kumar Tata, ALLEGRO MICROSYSTEMS LLC; Bhanu Singh, MathWorks; Sanjay Chatterjee, ALLEGRO MICROSYSTEMS LLC; Eric Cigan, MathWorks; Surekha Kollepara, ALLEGRO MICROSYSTEMS LLC; Kamel Belhous, Allegro Microsystems

  • Prathik R, Samsung Semiconductor India Research, Bengaluru; Ramesh Madatha, Samsung Semiconductor India Research, Bengaluru; Girish Kumar Gupta, Samsung Semiconductor India Research, Bengaluru; Tony Gladvin George, Samsung Electronics, Korea

  • Neha Goyal, Nvidia Corp.; Justin Refice, Nvidia Corp.

  • Rich Edelman, Siemens EDA

Technical Session 5 [Functional Safety and Verification]

Tuesday, March 5, 2024

  • Sougata Bhattacharjee, Samsung Semiconductor India Research (SSIR); Gulshan Kumar Sharma, Samsung Semiconductor India Research (SSIR); Wonil Cho, Samsung Electronics; Akshaya Kumar Jain, Samsung Semiconductor India Research (SSIR); James Kim, Siemens; Andrey Likhopoy, Samsung Electronics; Sangkyu Park, Samsung Electronics; Hyeonuk Noh, Samsung Electronics; Ann Keffer, Siemens; Arun Gogineni, Siemens

  • Andrey Likhopoy, Samsung Electronics; Sangkyu Park, Samsung Electronics; Hyeonuk Noh, Samsung Electronics; Wonil Cho, Samsung Electronics; Inhwan Kim, Siemens EDA; Robert Serphillips, Siemens EDA; Chanjin Kim, Siemens EDA; Justin Lee, Siemens EDA; James Kim, Siemens EDA; Sougata Bhattacharjee, Samsung Semiconductor India Research (SSIR); Gulshan Kumar Sharma, Samsung Semiconductor India Research (SSIR); Akshaya Kumar Jain, Samsung Semiconductor India Research (SSIR)

  • Suresh Vasu, Intel Corporation; Palanivel Guruvareddiar, Intel Corporation; Pooja Sundar, Intel Corporation

  • James(JAE YUN) Kim, Siemens EDA; Arun Gogineni, Siemens EDA; Ann Keffer, Siemens EDA; Ahn Hyunsun, Samsung LSI

Technical Session 6 [RISCV Design & Verification]

Tuesday, March 5, 2024

  • Puneet Goel, Incore Semiconductors; Ritu Goel, Coverify Systems Technology; Jyoti Dahiya, Coverify Systems Technology

  • Jon Taylor, Imperas Software

  • Chenhui Huang, Tenstorrent Inc.; Yu Sun, Tenstorrent Inc.; Joe Rahmeh, Tenstorrent Inc.

  • Aimee Sutton, Imperas Software Ltd.

Oral/Lecture Sessions-Day 2:

Technical Session 7 [Requirements Definition and Traceability]

Wednesday, March 6, 2024

  • So Wonyeong, Samsung Electronics; Yang Yonghyun, Samsung Electronics; Roe Sun-il, Samsung Electronics; Jang Moonki, Samsung Electronics; Kim Youngsik, Samsung Electronics; Choi Seonil, Samsung Electronics

  • Kirolos Mikhael, Siemens EDA; Abelouhab Ayari, Siemens EDA

  • Prashantkumar Ravindra, Analog Devices; Barry Briscoe, Analog Devices; Miguel Castillo, Analog Devices; Nimay Shah, Analog Devices

Technical Session 8 [Mixed Signal with UVM Verification]

Tuesday, March 5, 2024

  • Simul Barua, Ulkasemi Inc.; FNU Farshad, Ulkasemi Inc.; Henry Chang, Designer’s Guide Consulting, Inc.

Wednesday, March 6, 2024

  • Jonathan David, Innophase, Inc.; Henry Chang, Designer's Guide Consulting, Inc.

  • Sandeep Sharma, Meta Platforms Inc.

Technical Session 9 [SystemVerilog Verification Techniques]

Wednesday, March 6, 2024

  • Doug Smith, Doulos

  • Salman Tanvir, Infineon Technologies; David Crutchfield, Infineon Technologies; Markus Brosch, Infineon Technologies

  • Dillan Mills, Synopsys, Inc.; Chip Haldane, The Chip Abides, LLC

Technical Session 10 [Requirements Definition and Traceability]

Wednesday, March 6, 2024

  • Fernando Orge, Allegro MicroSystems

  • Jan Kreisinger, Allegro MicroSystems, Inc; Sanjay Chatterjee, Allegro MicroSystems, Inc

  • William Moore, Paradigm Works

Technical Session 11 [Formal: Liveness and Use Cases]

Wednesday, March 6, 2024

  • Ankit Garg, Nvidia

  • Nitish Sharma, Qualcomm Inc; Venkata Nishanth Narisetty, Qualcomm Inc

  • Erik Seligman, Cadence; Karthik Baddam, Qualcomm

Technical Session 12 [Analog Modeling in SystemVerilog]

Wednesday, March 6, 2024

  • Mariam Maurice, Siemens EDA

  • SangGi Do, Samsung Electronics; Seongeun Shin, Samsung Electronics; JungKyu Jang, Samsung Electronics; Dohui Kim, Samsung Electronics

  • FNU Farshad, Ulkasemi Inc; Shafaitul Islam Surush, Ulkasemi Inc.; Simul Barua, Ulkasemi Inc

Posters

Tuesday, March 5, 2024

  • Ashfaq Khan, Intel Corporation; Shuhui Lin, Intel Corporation; Daniel Standring, Intel Corporation; Adam Campos, Intel Corporation; Satish Venkatesan, Intel Corporation; Soowan Suh, Intel Corporation

  • Kaiwen Chin, Renesas; Esra Sahin, Renesas; Kranthi Pamarthi, Renesas

  • Kyoungmin Park, Samsung Electronics; Brad Budlong, Cadence Design Systems; Hyundon Kim, Samsung Electronics; Danny Yi, Cadence Design Systems; Gibs Lee, Cadence Design Systems; Jaehunn Lee, Samsung Electronics; Chulmin Kim, Samsung Electronics; Jaemin Choi, Samsung Electronics; Kijung Yoo, Samsung Electronics; Youngsik Kim, Samsung Electronics; Yogesh Goel, Cadence Design Systems; Seonil Brian Choi, Samsung Electronics

  • Endri Kaja, Infineon Technologies AG; Nicolas Gerlin, Infineon Technologies AG; Ungsang Yun, Infineon Technologies AG; Jad Al Halabi, Infineon Technologies AG; Sebastian Prebeck, Infineon Technologies AG; Dominik Stoffel, Rheinland-Pfälzische Technische Universität; Wolfgang Kunz, Rheinland-Pfälzische Technische Universität; Wolfgang Ecker, Infineon Technologies AG

  • Suhas D S, Intel; Ponsankar Arumugam, Intel; Deepmala Sachan, Intel; Ritesh Jain, Intel

  • Seungyeon Yu, Samsung Electronics, Memory Division; Damin Son, Samsung Electronics, Memory Division

  • Vineeth B, Intel Technology India Pvt Ltd; Deepmala Sachan, Intel Technology India Pvt Ltd; Ritesh Jain, Intel Technology India Pvt Ltd

  • Farhad Ahmed, Siemens EDA; Manish Bhati, Siemens EDA; Lyle Benson, Siemens EDA

  • Nicholas Nuti, Intel Corporation; Srinivasan Jambulingam, Intel Corporation

  • Sharada Vajja, Google LLC; Raghu Alamuri, Google LLC; Saksham Mehra, Google LLC

  • Emiliano Morini, Intel; Bill Zorn, Intel; Disha Puri, Intel; Madhurima Eranki, Intel; Shravya Jampana, Intel

  • Deepak Narayan Gadde, Infineon Technologies; Suruchi Kumari, Infineon Technologies; Aman Kumar, Infineon Technologies

  • Nimay Shah, Analog Devices Inc.; Pranav Dhayagude, Analog Devices Inc.; Paul Wright, Analog Devices Inc.; Raj Mitra, Cadence Design Systems Inc.

  • Charles Dancak, Betasoft Inc.

  • Santosh Kumar, Qualcomm Technologies Inc; Yogish Raja, Qualcomm Technologies Inc; Geetika Agrawal, Qualcomm Technologies Inc; Karthikeyan Sugumaran, Qualcomm Technologies Inc; Arjun Vazhayil, Qualcomm Technologies Inc; Tommy Brunansky, Qualcomm Technologies Inc.