Oral/Lecture Sessions-Day 1:
Technical Session 1 [Functional Coverage Closure]
Tuesday, March 5, 2024
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Seokho Lee, FuriosaAI; Youngsik Kim, FuriosaAI; Suhyung Kim, FuriosaAI; Jeong Ki Lee, FuriosaAI; Wooyoung Choe, FuriosaAI; Minho Kim, FuriosaAI
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Robert Kunzelmann, Infineon Technologies AG, Technical University of Munich; Aishwarya Sridhar, Infineon Technologies AG; Daniel Gerl, Infineon Technologies AG, Technical University of Munich; Lakshmi Vidhath Boga, Infineon Technologies AG; Wolfgang Ecker, Infineon Technologies AG, Technical University of Munich
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Jikjoo Lee, Samsung Electronics, Memory Division South Korea; Kihyun Park, Samsung Electronics, Memory Division South Korea; Tony Gladvin George, Samsung Electronics, Memory Division South Korea; Dongkun An, Samsung Electronics, Memory Division South Korea; Wooseong Cheong, Samsung Electronics, Memory Division South Korea; Byungchul Yoo, Samsung Electronics, Memory Division South Korea
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Yash Phogat, Arm Inc.; Patrick Hamilton, Arm Inc.
Technical Session 2 [AI & ML in Verification]
Tuesday, March 5, 2024
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Siarhei Zalivaka, Solidigm
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Aman Kumar, Infineon Technologies; Deepak Narayan Gadde, Infineon Technologies; Thomas Nalapat, Infineon Technologies; Evgenii Rezunov, Infineon Technologies; Fabio Cappellini, Infineon Technologies
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Olivera Stojanovic, Vtool; Nemanja Mitrovic, Vtool; Anna Revitzki, Vtool
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Dan Yu, Siemens EDA; Harry Foster, Siemens EDA; Eman El Mandouh, Siemens EDA; Waseem Raslan, Siemens EDA; Tom Fitzpatrick, Siemens EDA
Technical Session 3 [Formal Verification Use Cases]
Tuesday, March 5, 2024
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Bryan Olmos, Infineon Technologies AG; Sanjana Sainath, Infineon Technologies AG; Wolfgang Kunz, Rheinland-Pfälzische Technische Universität Kaiserslautern-Landau; Djones Lettnin, Infineon Technologies AG
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Shuhang Zhang, Infineon Technologies AG; Bryan Olmos, Infineon Technologies AG; Basavaraj Naik, Infineon Technologies AG
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Abhishek Asi, Intel; Anshul Jain, Intel; Virginia Bao, Intel
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Mike Walsh, Siemens EDA; Jin Hou, Siemens EDA
Technical Session 4 [UVM Testbenches]
Tuesday, March 5, 2024
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Aswini Kumar Tata, ALLEGRO MICROSYSTEMS LLC; Bhanu Singh, MathWorks; Sanjay Chatterjee, ALLEGRO MICROSYSTEMS LLC; Eric Cigan, MathWorks; Surekha Kollepara, ALLEGRO MICROSYSTEMS LLC; Kamel Belhous, Allegro Microsystems
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Prathik R, Samsung Semiconductor India Research, Bengaluru; Ramesh Madatha, Samsung Semiconductor India Research, Bengaluru; Girish Kumar Gupta, Samsung Semiconductor India Research, Bengaluru; Tony Gladvin George, Samsung Electronics, Korea
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Neha Goyal, Nvidia Corp.; Justin Refice, Nvidia Corp.
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Rich Edelman, Siemens EDA
Technical Session 5 [Functional Safety and Verification]
Tuesday, March 5, 2024
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Sougata Bhattacharjee, Samsung Semiconductor India Research (SSIR); Gulshan Kumar Sharma, Samsung Semiconductor India Research (SSIR); Wonil Cho, Samsung Electronics; Akshaya Kumar Jain, Samsung Semiconductor India Research (SSIR); James Kim, Siemens; Andrey Likhopoy, Samsung Electronics; Sangkyu Park, Samsung Electronics; Hyeonuk Noh, Samsung Electronics; Ann Keffer, Siemens; Arun Gogineni, Siemens
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Andrey Likhopoy, Samsung Electronics; Sangkyu Park, Samsung Electronics; Hyeonuk Noh, Samsung Electronics; Wonil Cho, Samsung Electronics; Inhwan Kim, Siemens EDA; Robert Serphillips, Siemens EDA; Chanjin Kim, Siemens EDA; Justin Lee, Siemens EDA; James Kim, Siemens EDA; Sougata Bhattacharjee, Samsung Semiconductor India Research (SSIR); Gulshan Kumar Sharma, Samsung Semiconductor India Research (SSIR); Akshaya Kumar Jain, Samsung Semiconductor India Research (SSIR)
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Suresh Vasu, Intel Corporation; Palanivel Guruvareddiar, Intel Corporation; Pooja Sundar, Intel Corporation
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James(JAE YUN) Kim, Siemens EDA; Arun Gogineni, Siemens EDA; Ann Keffer, Siemens EDA; Ahn Hyunsun, Samsung LSI
Technical Session 6 [RISCV Design & Verification]
Tuesday, March 5, 2024
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Puneet Goel, Incore Semiconductors; Ritu Goel, Coverify Systems Technology; Jyoti Dahiya, Coverify Systems Technology
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Jon Taylor, Imperas Software
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Chenhui Huang, Tenstorrent Inc.; Yu Sun, Tenstorrent Inc.; Joe Rahmeh, Tenstorrent Inc.
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Aimee Sutton, Imperas Software Ltd.
Oral/Lecture Sessions-Day 2:
Technical Session 7 [Requirements Definition and Traceability]
Wednesday, March 6, 2024
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So Wonyeong, Samsung Electronics; Yang Yonghyun, Samsung Electronics; Roe Sun-il, Samsung Electronics; Jang Moonki, Samsung Electronics; Kim Youngsik, Samsung Electronics; Choi Seonil, Samsung Electronics
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Kirolos Mikhael, Siemens EDA; Abelouhab Ayari, Siemens EDA
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Prashantkumar Ravindra, Analog Devices; Barry Briscoe, Analog Devices; Miguel Castillo, Analog Devices; Nimay Shah, Analog Devices
Technical Session 8 [Mixed Signal with UVM Verification]
Tuesday, March 5, 2024
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Simul Barua, Ulkasemi Inc.; FNU Farshad, Ulkasemi Inc.; Henry Chang, Designer’s Guide Consulting, Inc.
Wednesday, March 6, 2024
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Jonathan David, Innophase, Inc.; Henry Chang, Designer's Guide Consulting, Inc.
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Sandeep Sharma, Meta Platforms Inc.
Technical Session 9 [SystemVerilog Verification Techniques]
Wednesday, March 6, 2024
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Doug Smith, Doulos
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Salman Tanvir, Infineon Technologies; David Crutchfield, Infineon Technologies; Markus Brosch, Infineon Technologies
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Dillan Mills, Synopsys, Inc.; Chip Haldane, The Chip Abides, LLC
Technical Session 10 [Requirements Definition and Traceability]
Wednesday, March 6, 2024
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Fernando Orge, Allegro MicroSystems
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Jan Kreisinger, Allegro MicroSystems, Inc; Sanjay Chatterjee, Allegro MicroSystems, Inc
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William Moore, Paradigm Works
Technical Session 11 [Formal: Liveness and Use Cases]
Wednesday, March 6, 2024
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Ankit Garg, Nvidia
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Nitish Sharma, Qualcomm Inc; Venkata Nishanth Narisetty, Qualcomm Inc
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Erik Seligman, Cadence; Karthik Baddam, Qualcomm
Technical Session 12 [Analog Modeling in SystemVerilog]
Wednesday, March 6, 2024
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Mariam Maurice, Siemens EDA
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SangGi Do, Samsung Electronics; Seongeun Shin, Samsung Electronics; JungKyu Jang, Samsung Electronics; Dohui Kim, Samsung Electronics
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FNU Farshad, Ulkasemi Inc; Shafaitul Islam Surush, Ulkasemi Inc.; Simul Barua, Ulkasemi Inc
Posters
Tuesday, March 5, 2024
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Ashfaq Khan, Intel Corporation; Shuhui Lin, Intel Corporation; Daniel Standring, Intel Corporation; Adam Campos, Intel Corporation; Satish Venkatesan, Intel Corporation; Soowan Suh, Intel Corporation
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Kaiwen Chin, Renesas; Esra Sahin, Renesas; Kranthi Pamarthi, Renesas
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Kyoungmin Park, Samsung Electronics; Brad Budlong, Cadence Design Systems; Hyundon Kim, Samsung Electronics; Danny Yi, Cadence Design Systems; Gibs Lee, Cadence Design Systems; Jaehunn Lee, Samsung Electronics; Chulmin Kim, Samsung Electronics; Jaemin Choi, Samsung Electronics; Kijung Yoo, Samsung Electronics; Youngsik Kim, Samsung Electronics; Yogesh Goel, Cadence Design Systems; Seonil Brian Choi, Samsung Electronics
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Endri Kaja, Infineon Technologies AG; Nicolas Gerlin, Infineon Technologies AG; Ungsang Yun, Infineon Technologies AG; Jad Al Halabi, Infineon Technologies AG; Sebastian Prebeck, Infineon Technologies AG; Dominik Stoffel, Rheinland-Pfälzische Technische Universität; Wolfgang Kunz, Rheinland-Pfälzische Technische Universität; Wolfgang Ecker, Infineon Technologies AG
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Suhas D S, Intel; Ponsankar Arumugam, Intel; Deepmala Sachan, Intel; Ritesh Jain, Intel
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Vineeth B, Intel Technology India Pvt Ltd; Deepmala Sachan, Intel Technology India Pvt Ltd; Ritesh Jain, Intel Technology India Pvt Ltd
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Farhad Ahmed, Siemens EDA; Manish Bhati, Siemens EDA; Lyle Benson, Siemens EDA
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Nicholas Nuti, Intel Corporation; Srinivasan Jambulingam, Intel Corporation
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Sharada Vajja, Google LLC; Raghu Alamuri, Google LLC; Saksham Mehra, Google LLC
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Emiliano Morini, Intel; Bill Zorn, Intel; Disha Puri, Intel; Madhurima Eranki, Intel; Shravya Jampana, Intel
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Deepak Narayan Gadde, Infineon Technologies; Suruchi Kumari, Infineon Technologies; Aman Kumar, Infineon Technologies
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Nimay Shah, Analog Devices Inc.; Pranav Dhayagude, Analog Devices Inc.; Paul Wright, Analog Devices Inc.; Raj Mitra, Cadence Design Systems Inc.
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Charles Dancak, Betasoft Inc.
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Santosh Kumar, Qualcomm Technologies Inc; Yogish Raja, Qualcomm Technologies Inc; Geetika Agrawal, Qualcomm Technologies Inc; Karthikeyan Sugumaran, Qualcomm Technologies Inc; Arjun Vazhayil, Qualcomm Technologies Inc; Tommy Brunansky, Qualcomm Technologies Inc.