Session 5: AI & ML Coverage Closure

 Session Chair: Kamel Belhous

• [1019] AFCML: Accelerating the Functional Coverage through Machine Learning within a UVM Framework 
  • Syed Jawad Shah, National University of Science & Technology (NUST), Islamabad; Majeed Ahmed, National University of Science & Technology (NUST), Islamabad; Muhammad Imran, National University of Science & Technology (NUST), Islamabad; Haroon Waris, National University of Science & Technology (NUST), Islamabad; Nasir Mohyuddin, National University of Science & Technology (NUST), Islamabad; Muhammad Mahboob Ur Rehman, DreamBig Semiconductor       
• [1022] Reaching 100% Functional Coverage Using Machine Learning: A Journey of Persistent Efforts 
  • Jaecheon Kim, Samsung Electronics Co., Ltd.; Taewook Nam, Samsung Electronics Co., Ltd.; Wonil Cho, Samsung Electronics Co., Ltd.
• [1063] Stimulus Diversification and Coverage Closure of 3D NAND Flash with Artificial Intelligence 
  • Goutham Pallela, Micron Technology, Inc.; Peiyao Shi, Micron Technology, Inc.; Srinivas Deshmukh, Micron Technology, Inc.; Rohit Suvarna, VerifAI Inc.; Sandeep Srinivasan, VerifAI Inc.; Bill Hughes, VerifAI Inc.; Vaishnavi Venkatesh, Micron Technology, Inc.      
• [1096] Functional Coverage Closure in SoC Interconnect Verification with Iterative Machine Learning 
  • Jihye Kwon, Cadence Design Systems; Sukwon Ha, Samsung Electronics Co., Ltd.; Youngsik Kim, Samsung Electronics Co., Ltd.; Seonil Choi, Samsung Electronics Co., Ltd.; Daeseo Cha, Samsung Electronics Co., Ltd.; Space Kim, Samsung Electronics Co., Ltd.; Kunhyuk Kang, Samsung Electronics Co., Ltd.; John Pierce, Cadence Design Systems; Amit Metodi, Cadence Design Systems; Saurabh Sharma, Cadence Design Systems; Heedo Jung, Cadence Design Systems; Yosinori Watanabe, Cadence Design Systems